Ml. Lin et al., THE EPOXY-POLYCARBONATE BLENDS CURED WITH ALIPHATIC AMINE .1. MECHANISM AND KINETICS, Journal of polymer science. Part B, Polymer physics, 35(13), 1997, pp. 2169-2181
Reaction mechanism of the PC-epoxy blends cured by aliphatic amine has
been investigated by varying PC contents in the blends. The transamid
ation reaction tends to convert nearly all the carbonates into N-aliph
atic aromatic carbamates even at ambient temperature before normal cur
ing. The remaining amine proceeds the normal curing with epoxy at a hi
gher temperature (80 degrees C). For the PC-epoxy/aliphatic amine blen
d containing 6 wt % PC, the yielded N-aliphatic aromatic carbamate fur
ther reacts with amine to produce the urea structure. The urea undergo
es substitution reaction with the hydroxyl formed from the normal curi
ng to give the N-aliphatic aliphatic carbamate. For the blend containi
ng 12 wt % PC, the N-aliphatic aromatic carbamate converts into the N-
aliphatic aliphatic carbamate via two different routes. For the blend
containing lower molecular weight of the aliphatic amine, the N-alipha
tic aromatic carbamate reacts with hydroxyl to form the N-aliphatic al
iphatic carbamate directly. For the blend containing higher molecular
weight of aliphatic amine, the N-aliphatic aromatic carbamate decompos
es into the aliphatic isocyanate accelerated by the presence of the re
sidual oxirane. The isocyanate formed then reacts with hydroxyl to yie
ld the N-aliphatic aliphatic carbamate. The activation energy (E-alpha
) and preexponential factor (A) of the PC-epoxy/POPDA blends decrease
with the increase of the PC content. Kinetic study by thermal analysis
by the method of autocatalyzed model is able to correctly predict oxi
rane conversion vs. time relationship for the neat epoxy/aliphatic ami
ne and the PC-epoxy/aromatic amine systems because the dominant reacti
on is the normal curing reaction between amine and oxirane. The model
fails to predict the PC-epoxy/aliphatic amine system because the syste
m is complicated by several other reactions besides the normal curing
reaction. (C) 1997 John Wiley & Sons, Inc.