SIMULATION OF THERMALLY-INDUCED PACKAGE EFFECTS WITH REGARD TO PIEZORESISTIVE PRESSURE SENSORS

Authors
SCHILLING F LANGHEINRICH W WEIBLEN K ARAND D
Citation
F. Schilling et al., SIMULATION OF THERMALLY-INDUCED PACKAGE EFFECTS WITH REGARD TO PIEZORESISTIVE PRESSURE SENSORS, Sensors and actuators. A, Physical, 60(1-3), 1997, pp. 37-39
Citations number
6
Categorie Soggetti
Engineering, Eletrical & Electronic","Instument & Instrumentation
Journal title
Sensors and actuators. A, Physical → ACNP
ISSN journal
09244247
Volume
60
Issue
1-3
Year of publication
1997
Pages
37 - 39
Database
ISI
SICI code
0924-4247(1997)60:1-3<37:SOTPEW>2.0.ZU;2-N
Abstract
Microsystems are on their way out of laboratories into production. One of these microsystems, a piezoresistive pressure sensor developed by Robert Bosch GmbH, is examined within this paper. Obviously, one can d etect undesirable temperature effects resulting from the sensor packag e, which influence the electrical characteristics of the sensor, By me ans of finite-element modelling (FEM), a simulation of the temperature effects can be managed. It is also possible to search for alternative designs of the sensor package.