MICROMACHINING OF (HHL) SILICON STRUCTURES - EXPERIMENTS AND 3D SIMULATION OF ETCHED SHAPES

Citation
Cr. Tellier et S. Durand, MICROMACHINING OF (HHL) SILICON STRUCTURES - EXPERIMENTS AND 3D SIMULATION OF ETCHED SHAPES, Sensors and actuators. A, Physical, 60(1-3), 1997, pp. 168-175
Citations number
25
Categorie Soggetti
Engineering, Eletrical & Electronic","Instument & Instrumentation
ISSN journal
09244247
Volume
60
Issue
1-3
Year of publication
1997
Pages
168 - 175
Database
ISI
SICI code
0924-4247(1997)60:1-3<168:MO(SS->2.0.ZU;2-I
Abstract
The micromachining of various (hhl) silicon plates in a 35% KOH-water etchant is studied. Experimental shapes for membranes and mesa etched with initially circular masks are discussed. Theoretical 3D etched sha pes for such microstructures are derived from a numerical simulation b ased on the tensorial model for the anisotropic wet etching. Experimen tal and theoretical shapes show a fair agreement, indicating a satisfa ctory adjustment of the dissolution slowness surface related to the et ching of silicon in KOH etchant. The interest of the 3D simulation for designing mask patterns is outlined.