DEVELOPMENT OF HD-DV MULTI PRINTED WIRING BOARD FOR HIGH-DENSITY MCM-L

The HD-DV Multi (High Density-Dimple Via Multi) Printed Wiring Board ( PWB) has been developed, by combining build-up process and additive pr ocess for the high density interconnection such as Multichip Module (M CM) packages. The key technologies in this PWB include the dryfilm typ e photo-imageable dielectric material which is developed with an alkal ine solution and the ultra fine patterning technology which is perform ed by the additive process using photo-imageable permanent mask and hi gh-speed electroless copper plating. By using these technologies, very high-performance PWBs have been produced such as the conductor line w idth/space of 35 mu m/35 mu m and the via diameter of 0.1 mm. This boa rd has high peel strength and high reliability in the thermal shock te st and the high humidity test. This board can also accommodate solder bumps easily on narrow pitch pads for its solder dam structures and is applicable to bare chip packaging.