A NEW LOW-TEMPERATURE ELECTROLESS NICKEL-PLATING PROCESS

Authors
CHEN K CHEN Y
Citation
K. Chen et Y. Chen, A NEW LOW-TEMPERATURE ELECTROLESS NICKEL-PLATING PROCESS, Plating and surface finishing, 84(9), 1997, pp. 80-82
Citations number
3
Categorie Soggetti
Metallurgy & Metallurigical Engineering","Materials Science, Coatings & Films
Journal title
Plating and surface finishing → ACNP
ISSN journal
03603164
Volume
84
Issue
9
Year of publication
1997
Pages
80 - 82
Database
ISI
SICI code
0360-3164(1997)84:9<80:ANLENP>2.0.ZU;2-V
Abstract
A new Iom-temperature electroless nickel plating process was developed by adding some inorganic agents to the plating solution, in which cit rate acted as complexing agent, With the optimum process determined, h igh deposition rate was obtained, resulting in a bright deposit with e xcellent adhesion.