NEW POLYSILICON-OXIDE-NITRIDE-OXIDE-SILICON ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY DEVICE APPROACH FOR ELIMINATING OFF-CELL LEAKAGE CURRENT
Jk. Lin et al., NEW POLYSILICON-OXIDE-NITRIDE-OXIDE-SILICON ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY DEVICE APPROACH FOR ELIMINATING OFF-CELL LEAKAGE CURRENT, JPN J A P 1, 33(5A), 1994, pp. 2513-2514
A new polysilicon-oxide-nitride-oxide-silicon (SONOS) electrically era
sable programmable read-only memory (EEPROM) device, which eliminated
off-cell leakage current, has been described and fabricated. The leaka
ge current is easily encountered in metal-nitride-oxide-silicon (MNOS)
-type EEPROMs. Two parasitic transistors, which are in parallel with t
he desired variable V(t) cell, are responsible for the leakage current
. We demonstrated that the parasitic transistors are caused either by
the nearly constant-threshold-voltage parasitic transistors surroundin
g the active region or by the ''fringing effect'' in poly-Si gate edge
s. The on-state and off-state I-V curves of the cell are shown and com
pared with those of two other different devices. The results reveal th
at the off-cell leakage current, which is observed in the other two de
vices, is completely eliminated in the proposed cell.