The interface trap density in oxides grown on 6H silicon carbide by re
mote plasma-enhanced chemical vapor deposition as well as by thermal o
xidation is studied. This trap density is found to be drastically redu
ced by a plasma-assisted PDP (pre-deposition process) in hydrogen. The
reduction is stable if a high-temperature annealing step is carried o
ut which excludes a simple passivation by hydrogen. (C) 1997 Elsevier
Science S.A.