Sy. Luo et al., ANALYSIS OF THE WEAR OF A RESIN-BONDED DIAMOND WHEEL IN THE GRINDING OF TUNGSTEN CARBIDE, Journal of materials processing technology, 69(1-3), 1997, pp. 289-296
This paper describes experimental results using a resin-bonded diamond
wheel in the vertical dry grinding of P10 grade tungsten carbide. The
conditions of the diamond abrasive cutting edge on the worn wheel sur
face, the bonding state between the abrasives and the matrix, and the
grinding performance were investigated. It was found that for interrup
ted dry grinding, the abrasive cutting edges occurring on the worn whe
el surface are mainly of protrusive (good) particles and the number of
pull-out holes is also high as well, leading the wheel to produce a h
igher grinding ratio. However, under a greater stock removal rate, the
grinding ratio would be reduced rapidly. When continuous dry grinding
was employed, the resulting worn abrasives produce a greater proporti
on of particle pull-out and coated grit exposed on the wheel surface,
thereby causing very poor grinding performance. Graphite fillers added
to the resin bond have a positive influence on the grinding performan
ce of the wheel in dry grinding. In addition, the roughness of the gro
und surface is similar to that effected by mechanical polishing. (C) 1
997 Elsevier Science S.A.