ANALYSIS OF THE WEAR OF A RESIN-BONDED DIAMOND WHEEL IN THE GRINDING OF TUNGSTEN CARBIDE

Citation
Sy. Luo et al., ANALYSIS OF THE WEAR OF A RESIN-BONDED DIAMOND WHEEL IN THE GRINDING OF TUNGSTEN CARBIDE, Journal of materials processing technology, 69(1-3), 1997, pp. 289-296
Citations number
5
Categorie Soggetti
Material Science
ISSN journal
09240136
Volume
69
Issue
1-3
Year of publication
1997
Pages
289 - 296
Database
ISI
SICI code
0924-0136(1997)69:1-3<289:AOTWOA>2.0.ZU;2-X
Abstract
This paper describes experimental results using a resin-bonded diamond wheel in the vertical dry grinding of P10 grade tungsten carbide. The conditions of the diamond abrasive cutting edge on the worn wheel sur face, the bonding state between the abrasives and the matrix, and the grinding performance were investigated. It was found that for interrup ted dry grinding, the abrasive cutting edges occurring on the worn whe el surface are mainly of protrusive (good) particles and the number of pull-out holes is also high as well, leading the wheel to produce a h igher grinding ratio. However, under a greater stock removal rate, the grinding ratio would be reduced rapidly. When continuous dry grinding was employed, the resulting worn abrasives produce a greater proporti on of particle pull-out and coated grit exposed on the wheel surface, thereby causing very poor grinding performance. Graphite fillers added to the resin bond have a positive influence on the grinding performan ce of the wheel in dry grinding. In addition, the roughness of the gro und surface is similar to that effected by mechanical polishing. (C) 1 997 Elsevier Science S.A.