Rk. Islamgaliev et al., THE DETERMINATION OF THE GRAIN-BOUNDARY WIDTH OF ULTRAFINE GRAINED COPPER AND NICKEL FROM ELECTRICAL-RESISTIVITY MEASUREMENTS, Physica status solidi. a, Applied research, 162(2), 1997, pp. 559-566
The grain size distribution of copper and nickel processed by severe p
lastic deformation was studied by transmission electron microscopy. Th
e temperature dependence of electrical resistivity in the temperature
range from 20 to 300 K is presented. The tunnel model of electrical re
sistivity of grain boundaries is discussed. The width of the potential
barrier at grain boundaries in copper and nickel is determined. Large
r values of potential barriers are noted in ultrafine grained material
s in comparison to the crystallographic width of grain boundaries.