THE DETERMINATION OF THE GRAIN-BOUNDARY WIDTH OF ULTRAFINE GRAINED COPPER AND NICKEL FROM ELECTRICAL-RESISTIVITY MEASUREMENTS

Citation
Rk. Islamgaliev et al., THE DETERMINATION OF THE GRAIN-BOUNDARY WIDTH OF ULTRAFINE GRAINED COPPER AND NICKEL FROM ELECTRICAL-RESISTIVITY MEASUREMENTS, Physica status solidi. a, Applied research, 162(2), 1997, pp. 559-566
Citations number
16
Categorie Soggetti
Physics, Condensed Matter
ISSN journal
00318965
Volume
162
Issue
2
Year of publication
1997
Pages
559 - 566
Database
ISI
SICI code
0031-8965(1997)162:2<559:TDOTGW>2.0.ZU;2-J
Abstract
The grain size distribution of copper and nickel processed by severe p lastic deformation was studied by transmission electron microscopy. Th e temperature dependence of electrical resistivity in the temperature range from 20 to 300 K is presented. The tunnel model of electrical re sistivity of grain boundaries is discussed. The width of the potential barrier at grain boundaries in copper and nickel is determined. Large r values of potential barriers are noted in ultrafine grained material s in comparison to the crystallographic width of grain boundaries.