HIGH-FREQUENCY MULTILAYER CHIP INDUCTORS

Authors
HSU JY LIN HC SHEN HD CHEN CJ
Citation
Jy. Hsu et al., HIGH-FREQUENCY MULTILAYER CHIP INDUCTORS, IEEE transactions on magnetics, 33(5), 1997, pp. 3325-3327
Citations number
3
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
Journal title
IEEE transactions on magnetics → ACNP
ISSN journal
00189464
Volume
33
Issue
5
Year of publication
1997
Part
1
Pages
3325 - 3327
Database
ISI
SICI code
0018-9464(1997)33:5<3325:HMCI>2.0.ZU;2-R
Abstract
High frequency multilayer chip inductors for the application in the ra dio frequency telecommunication terminals were fabricated using low te mperature sintered dielectric material. The thick-film printing and gr een sheet lamination processes were used for the chip fabrication. The inductors of 4.7, 12, and 22nH were made, which exhibit self-resonant frequency of 5.3 to 2.4GHz. The size of these monolithic inductors is 2.0 mm x 1.2 mm x 0.8 mm.