We have fabricated and tested GMR magnetic sensors that operate in the
CPP mode. This work is a continuation of the ultra-high density magne
tic sensor research introduced at INTERMAG 96. We have made two signif
icant modifications to the process sequence. First, contact to the sen
sor is made through a metal conduit deposited in situ with the multila
yers. This deposition replaces electroplating. This configuration ensu
res a good electrical interface between the top of multilayer stack an
d the top contact, and a continuous, conductive current path to the se
nsor. The consequences of this modification are an increase in yield o
f operational devices to greater than or equal to 90% per wafer and a
significant reduction of the device resistance to less than or equal t
o 560 mn and of the uniformity of the device resistance to less than o
r equal to 3%. Second, the as-deposited multilayer structure has been
changed from [Cu 30 Angstrom/Co 20 Angstrom](18) (third peak) to [Cu 2
0.5 Angstrom/Co 12 Angstrom](30) (second peak) to increase the GMR res
ponse, The best second peak CPP GMR response from a single device is 3
9%, The sensitivity of that device is 0.13%/Oe.