ADVANCED FLIP-CHIP SOLDER BONDING

Authors
HUMPSTON G NEEDHAM AP
Citation
G. Humpston et Ap. Needham, ADVANCED FLIP-CHIP SOLDER BONDING, Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 395(3), 1997, pp. 375-378
Citations number
NO
Categorie Soggetti
Nuclear Sciences & Tecnology","Physics, Particles & Fields","Instument & Instrumentation",Spectroscopy
Journal title
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment → ACNP
ISSN journal
01689002
Volume
395
Issue
3
Year of publication
1997
Pages
375 - 378
Database
ISI
SICI code
0168-9002(1997)395:3<375:AFSB>2.0.ZU;2-I
Abstract
Flip-chip solder bonding is becoming the established method for interc onnection of high performance semiconductor devices. It is used for th e assembly of pixelated detectors, multi-chip modules (MCMs) and monol ithic microwave integrated circuits (MMICs). The process has self-alig ning features that result in closely dimensioned and highly reproducib le array interconnections.