IEEE transactions on components, packaging, and manufacturing technology. Part A (Print)

Other titles
Transactions on components, packaging, and manufacturing technology.
Corp./Body Author
Institute of Electrical and Electronics Engineers.; Components, Packaging & Manufacturing Technology Society.
Place : Publisher

New York, NY : Institute of Electrical and Electronics Engineers (©1994-1998.)

From year - To year
1994-1998
Publication history
Vol. 17, no. 1 (Mar. 1994)-v. 21, no. 4 (Dec. 1998).
Type of resource
Periodical
Frequency
Quarterly
Language
English
Country of publication
United States
ISSN
1070-9886
ISSN-L
1070-9886
Codice Dewey code
621.317
Medium
Printed text
Journal public access
http://ieeexplore.ieee.org/servlet/opac?punumber=95
Continued by
IEEE transactions on components and packaging technologies (Print)
Continued in part by
IEEE transactions on components, hybrids and manufacturing technology
Other physical media
IEEE transactions on components, packaging, and manufacturing technology. Part A (Online)
Acnp cumulative hol.
1994-1998.
Journal CNR code
P 00202173
Journal ACNP code
85124
Permalink
http://acnpsearch.tweb-dev.unibo.it/journal/85124
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