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Results: 1-25/458
Authors:
BLACKBURN DL
COURTOIS B
Citation: Dl. Blackburn et B. Courtois, FOREWORD - THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES (THERMINIC), IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 397-398
Authors:
SZEKELY V
MARTA C
RENCZ M
VEGH G
BENEDEK Z
TOROK S
Citation: V. Szekely et al., A THERMAL BENCHMARK CHIP - DESIGN AND APPLICATIONS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 399-405
Authors:
RZEPKA S
BANERJEE K
MEUSEL E
HU CM
Citation: S. Rzepka et al., CHARACTERIZATION OF SELF-HEATING IN ADVANCED VLSI INTERCONNECT LINES BASED ON THERMAL FINITE-ELEMENT SIMULATION, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 406-411
Authors:
RAAD PE
WILSON JS
PRICE DC
Citation: Pe. Raad et al., ADAPTIVE MODELING OF THE TRANSIENTS OF SUBMICRON INTEGRATED-CIRCUITS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 412-417
Authors:
DECOGAN D
Citation: D. Decogan, PROPAGATION ANALYSIS FOR THERMAL MODELING, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 418-423
Authors:
SUSZYNSKI Z
MALINSKI M
BYCHTO L
Citation: Z. Suszynski et al., THERMAL PARAMETERS MEASUREMENT METHOD OF ELECTRONICS MATERIALS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 424-433
Authors:
SUSZYNSKI Z
Citation: Z. Suszynski, PHOTOTHERMAL EXAMINATION OF ADHESION IN SEMICONDUCTOR-DEVICES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 434-440
Authors:
RAVINDRA NM
ABEDRABBO S
GOKCE OH
TONG FM
PATEL A
VELAGAPUDI R
WILLIAMSON GD
MASZARA WP
Citation: Nm. Ravindra et al., RADIATIVE PROPERTIES OF SIMOX, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 441-449
Authors:
WONG CP
SHI SHH
JEFFERSON G
Citation: Cp. Wong et al., HIGH-PERFORMANCE NO-FLOW UNDERFILLS FOR LOW-COST FLIP-CHIP APPLICATIONS - MATERIAL CHARACTERIZATION, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 450-458
Authors:
EVANS J
EVANS JY
Citation: J. Evans et Jy. Evans, PACKAGING FACTORS AFFECTING THE FATIGUE LIFE OF POWER TRANSISTOR DIE BONDS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 459-468
Authors:
SIHLBOM R
DERNEVIK M
LAI ZH
STARSKI JP
LIU JH
Citation: R. Sihlbom et al., CONDUCTIVE ADHESIVES FOR HIGH-FREQUENCY APPLICATIONS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 469-477
Authors:
SIHLBOM R
DERNEVIK M
LINDGREN M
STARSKI JP
LAI ZH
LIU JH
Citation: R. Sihlbom et al., HIGH-FREQUENCY MEASUREMENTS AND SIMULATIONS ON WIRE-BONDED MODULES ONTHE SEQUENTIAL BUILDUP BOARDS (SBUS), IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 478-491
Authors:
CAMPBELL CK
VANWYK JD
HOLM MFK
Citation: Ck. Campbell et al., DEVELOPMENT OF LARGE-AREA BATIO3 CERAMICS WITH OPTIMIZED DEPLETION REGIONS AS DIELECTRICS FOR PLANAR POWER ELECTRONICS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 492-499
Authors:
TIMSIT RS
BOCK EM
CORMAN NE
Citation: Rs. Timsit et al., EFFECT OF SURFACE REACTIVITY OF LUBRICANTS ON THE PROPERTIES OF ALUMINUM ELECTRICAL CONTACTS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 500-505
Authors:
KURABAYASHI K
GOODSON KE
Citation: K. Kurabayashi et Ke. Goodson, PRECISION-MEASUREMENT AND MAPPING OF DIE-ATTACH THERMAL-RESISTANCE, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 506-514
Authors:
JACOBSON DM
SANGHA SPS
Citation: Dm. Jacobson et Sps. Sangha, A NOVEL LIGHTWEIGHT MICROWAVE PACKAGING TECHNOLOGY, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 515-520
Authors:
LEE SB
KATZ A
HILLMAN C
Citation: Sb. Lee et al., GETTING THE QUALITY AND RELIABILITY TERMINOLOGY STRAIGHT, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 521-523
Authors:
MORRIS JE
LIU J
Citation: Je. Morris et J. Liu, POLYMERIC ELECTRONICS PACKAGING - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 206-207
Authors:
KRISTIANSEN H
LIU J
Citation: H. Kristiansen et J. Liu, OVERVIEW OF CONDUCTIVE ADHESIVE INTERCONNECTION TECHNOLOGIES FOR LCDS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 208-214
Authors:
JAGT JC
Citation: Jc. Jagt, RELIABILITY OF ELECTRICALLY CONDUCTIVE ADHESIVE JOINTS FOR SURFACE-MOUNT APPLICATIONS - A SUMMARY OF THE STATE-OF-THE-ART, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 215-225
Authors:
YIM MJ
PAIK KW
Citation: Mj. Yim et Kw. Paik, DESIGN AND UNDERSTANDING OF ANISOTROPIC CONDUCTIVE FILMS (ACF) FOR LCD PACKAGING, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 226-234
Authors:
OGUIBE CN
MANNAN SH
WHALLEY DC
WILLIAMS DJ
Citation: Cn. Oguibe et al., CONDUCTION MECHANISMS IN ANISOTROPIC CONDUCTING ADHESIVE ASSEMBLY, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 235-242
Authors:
BEHNER U
HAUG R
SCHUTZ R
HARTNAGEL HL
Citation: U. Behner et al., CHARACTERIZATION OF ANISOTROPICALLY CONDUCTIVE ADHESIVE INTERCONNECTIONS BY 1 F NOISE MEASUREMENTS/, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 243-247
Authors:
WANG XT
WANG YL
CHEN GL
LIU J
LAI ZH
Citation: Xt. Wang et al., QUANTITATIVE ESTIMATE OF THE CHARACTERISTICS OF CONDUCTIVE PARTICLES IN ACA BY USING NANO INDENTER, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 248-251
Authors:
SUZUKI K
SUZUKI O
KOMAGATA M
Citation: K. Suzuki et al., CONDUCTIVE ADHESIVE MATERIALS FOR LEAD SOLDER REPLACEMENT, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 252-258