FOREWORD - THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES (THERMINIC)

Authors
BLACKBURN DL COURTOIS B
Citation
Dl. Blackburn et B. Courtois, FOREWORD - THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES (THERMINIC), IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 397-398
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part A → ACNP
ISSN journal
10709886
Volume
21
Issue
3
Year of publication
1998
Pages
397 - 398
Database
ISI
SICI code
1070-9886(1998)21:3<397:F-TIOI>2.0.ZU;2-7