CHARACTERIZATION OF SELF-HEATING IN ADVANCED VLSI INTERCONNECT LINES BASED ON THERMAL FINITE-ELEMENT SIMULATION

In this paper, self-heating of interconnects has been shown to affect the lifetime of next generation integrated circuits significantly more severely than today's, The paper proves the necessity for extending t he system of design rules, proposes a thermal design rule, and present s an efficient and quantitatively accurate thermal simulator as tool f or the design process.