CONDUCTIVE ADHESIVE MATERIALS FOR LEAD SOLDER REPLACEMENT

Various adhesives were tested for MLCC and integrated circuit (IC) app lications as lead solder replacements, mainly from the viewpoint of co ntact resistance and adhesion strength. Current-voltage and frequency characteristics were also measured. On the whole, the contact resistan ce depended on the volume resistivity of each adhesive. Different term ination and bump materials gave different contact resistance values. E specially, Sn plated terminations tended to give higher contact resist ance. The adhesion strengths were also influenced by the kinds of adhe sives, electrode, termination and bump materials, Although the Ni fill ed adhesive, which had good adhesion strength and didn't cause electro -migration, had higher volume resistivity, it gave good I-V characteri stics at low current.