A THERMAL BENCHMARK CHIP - DESIGN AND APPLICATIONS

Authors
SZEKELY V MARTA C RENCZ M VEGH G BENEDEK Z TOROK S
Citation
V. Szekely et al., A THERMAL BENCHMARK CHIP - DESIGN AND APPLICATIONS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 399-405
Citations number
13
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part A → ACNP
ISSN journal
10709886
Volume
21
Issue
3
Year of publication
1998
Pages
399 - 405
Database
ISI
SICI code
1070-9886(1998)21:3<399:ATBC-D>2.0.ZU;2-X
Abstract
A 1.2-mu m complementary metal-oxide-semiconductor (CMOS) thermal benc hmark chip has been designed, fabricated and tested. The chip is suita ble to support various steady-state and transient measurements, e.g., heating and cooling curves, in-chip thermal couplings, It facilitates the calibration of various chip temperature mapping equipment, Besides the description of the chip design experimental results are presented in order to demonstrate the wide usability of this measurement suppor ting tool.