R. Sihlbom et al., HIGH-FREQUENCY MEASUREMENTS AND SIMULATIONS ON WIRE-BONDED MODULES ONTHE SEQUENTIAL BUILDUP BOARDS (SBUS), IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 478-491
This paper presents the results from high-frequency measurements and s
imulations on sequential build-up boards (SBU's), A high-frequency tes
t pattern was designed in order to investigate the high-frequency prop
erties of SBU's, The SBU boards were supplied by four different manufa
cturers. The test boards contained patterns for cross talk, impedance
matching, stray capacitance, and wire-bonding. The test boards consist
ed of doublesided FR-4 core with two built-up layers on each side. How
ever, the high-frequency test board was only on one side of the core.
The test patterns were located in layer five and layer six. Two differ
ent line spacings between signal track and victim track, 50 and 100 mu
m, were considered, The S-parameters were measured on a network analy
zer in the frequency range 45 MHz-10 GHz, In the time domain experimen
t, the near-end and the far-end response in the victim track was measu
red. All the simulations were carried out, using the simulation progra
ms P-Spice, HP MDS, and a two-dimensional (2-D) finite difference prog
ram. Impedance measurements and simulations were performed in layer fi
ve and six with conductor widths corresponding to characteristic imped
ances of 50 and 55 Omega. The line widths ranged from 40 to 65 mu m in
layer five and 150 to 200 mu m in layer six, Reference tracks were de
signed in order to estimate conductor and dielectric losses. In the wi
re-bonding test, an isotropically conductive adhesive joint (TCA) was
investigated. A silicon test chip was mounted on the SBU-board. The re
sults show that cross talk measurements and simulations agreed closely
in the frequency range 45 MHz-10 GHz, Small differences between the t
hree Investigated dielectrics were obtained. The results show that die
lectric loss is a limiting factor in the high-frequency range. For a t
est-pattern length of 30 mm, the high-frequency limit (based on -3 dB
transmission losses), was 2-3 GHz in layer six and 3-4 GHz In layer fi
ve, The measured characteristic impedances ranged from 44-63 Omega, de
pending on the manufacturer of the SBU-board.