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Results: 1-25/143
Authors:
LAU JH
WESLING PB
Citation: Jh. Lau et Pb. Wesling, FOREWORD, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 766-767
Authors:
CHUN OG
AHN SH
JEONG MY
CHOY TG
Citation: Og. Chun et al., A STUDY ON INSERTION LOSS IMPROVEMENT FOR AN OPTICAL CONNECTOR USING THE ANALYSIS OF TRANSMITTED OPTICAL-INTENSITY, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 768-777
Authors:
YOSHIDA J
YAMADA M
TERUI H
Citation: J. Yoshida et al., PACKAGING AND RELIABILITY OF PHOTONIC COMPONENTS FOR SUBSCRIBER NETWORK SYSTEMS, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 778-782
Authors:
NORDIN RA
BUCHHOLZ DB
HUISMAN RF
BASAVANHALLY NR
LEVI AFJ
Citation: Ra. Nordin et al., HIGH-PERFORMANCE OPTICAL DATALINK ARRAY TECHNOLOGY, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 783-788
Authors:
WANG CY
CHEN YC
LEE CC
Citation: Cy. Wang et al., DIRECTLY DEPOSITED FLUXLESS LEAD-INDIUM-GOLD COMPOSITE SOLDER, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 789-793
Authors:
LAU JH
Citation: Jh. Lau, CREEP OF SOLDER INTERCONNECTS UNDER COMBINED LOADS, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 794-798
Authors:
BEIKMOHAMADI A
Citation: A. Beikmohamadi, EFFECT OF POST-REFLOW NO-CLEAN SOLDER PASTE RESIDUE ON ELECTRICAL PERFORMANCE, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 799-801
Authors:
HALBLEIB L
WORMINGTON P
CIESLAK W
STREET H
Citation: L. Halbleib et al., APPLICATION OF QUALITY FUNCTION DEPLOYMENT TO THE DESIGN OF A LITHIUMBATTERY, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 802-807
Authors:
ANDO T
TOMIOKA T
NAKAZONO M
ATSUMI K
TANE Y
NAKANO J
HIRATA S
Citation: T. Ando et al., FINE-PITCH TAB ASSEMBLY TECHNOLOGY FOR 820 PIN COUNT CERAMIC PGA USING SINGLE-POINT BONDING TECHNOLOGY AT ROOM-TEMPERATURE, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 808-816
Authors:
MIURA O
MIYAZAKI K
TAKAHASHI A
WATANABE R
MIWA T
Citation: O. Miura et al., FABRICATION OF THIN-FILM MULTILAYER SUBSTRATE USING COPPER CLAD POLYIMIDE SHEETS, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 817-821
Authors:
HIREMATH BV
Citation: Bv. Hiremath, EVALUATION OF TUMBLING PROCESSES OF MULTILAYER CERAMIC CAPACITORS FORSURFACE-MOUNT DEVICE APPLICATIONS, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 822-827
Authors:
CHANG DD
CRAWFORD PA
FULTON JA
MCBRIDE R
SCHMIDT MB
SINITSKI RE
WONG CP
Citation: Dd. Chang et al., AN OVERVIEW AND EVALUATION OF ANISOTROPICALLY CONDUCTIVE ADHESIVE FILMS FOR FINE-PITCH ELECTRONIC ASSEMBLY, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 828-835
Authors:
CHANG DD
FULTON JA
LING HC
SCHMIDT MB
SINITSKI RE
WONG CP
Citation: Dd. Chang et al., ACCELERATED LIFE TEST OF Z-AXIS CONDUCTIVE ADHESIVES, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 836-842
Authors:
LI L
LIZZUL C
KIM H
SACOLICK I
MORRIS JE
Citation: L. Li et al., ELECTRICAL, STRUCTURAL AND PROCESSING PROPERTIES OF ELECTRICALLY CONDUCTIVE ADHESIVES, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 843-851
Authors:
MORI M
KIZAKI Y
SAITO M
HONGU A
Citation: M. Mori et al., A FINE-PITCH COG TECHNIQUE FOR A TFT-LCD PANEL USING AN INDIUM ALLOY, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 852-857
Authors:
SURYANARAYANA D
WU TY
VARCOE JA
Citation: D. Suryanarayana et al., ENCAPSULANTS USED IN FLIP-CHIP PACKAGES, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 858-862
Authors:
WANG DW
PAPATHOMAS KI
Citation: Dw. Wang et Ki. Papathomas, ENCAPSULANT FOR FATIGUE LIFE ENHANCEMENT OF CONTROLLED-COLLAPSE CHIP CONNECTION (C4), IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 863-867
Authors:
WONG CP
MCBRIDE R
Citation: Cp. Wong et R. Mcbride, ROBUST TITANATE-MODIFIED ENCAPSULANTS FOR HIGH-VOLTAGE POTTING APPLICATION OF MULTICHIP-MODULE HYBRID IC, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 868-875
Authors:
TSUEI YS
CANGELLARIS AC
PRINCE JL
Citation: Ys. Tsuei et al., RIGOROUS ELECTROMAGNETIC MODELING OF CHIP-TO-PACKAGE (1ST-LEVEL) INTERCONNECTIONS, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 876-883
Authors:
PONNAPALLI S
DEUTSCH A
BERTIN R
Citation: S. Ponnapalli et al., A PACKAGE ANALYSIS TOOL BASED ON A METHOD OF MOMENTS SURFACE FORMULATION, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 884-892
Authors:
HIRUTA Y
HIRANO N
YAMAJI Y
MUKAI M
MOTOYAMA Y
HOMMA R
OHNO J
SUDO T
Citation: Y. Hiruta et al., AN 820 PIN PGA FOR ULTRALARGE-SCALE BICMOS DEVICES, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 893-901
Authors:
MAHULIKAR D
PASQUALONI A
CRANE J
BRADEN JS
Citation: D. Mahulikar et al., DEVELOPMENT OF A COST-EFFECTIVE HIGH-PERFORMANCE METAL QFP PACKAGING SYSTEM, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 902-908
Authors:
CHANG CS
Citation: Cs. Chang, RESISTIVE SIGNAL LINE WIRING NET DESIGNS IN MULTICHIP MODULES, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 909-918
Authors:
DJENNAS F
PRACK E
MATSUDA Y
Citation: F. Djennas et al., INVESTIGATION OF PLASMA EFFECTS ON PLASTIC PACKAGES DELAMINATION AND CRACKING, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 919-924
Authors:
JAEGER RC
SUHLING JC
CAREY MT
JOHNSON RW
Citation: Rc. Jaeger et al., OFF-AXIS SENSOR ROSETTES FOR MEASUREMENT OF THE PIEZORESISTIVE COEFFICIENTS OF SILICON, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 925-931