Citation: J. Chiodo et Eh. Billett, Designing a better tomorrow today with self-disassembling electronics, GREEN ELECTRONICS GREEN BOTTOM LINE, 2000, pp. 267-280
Citation: W. Trumble, A case study: A printed circuit assembly with a no-lead solder assembly process, GREEN ELECTRONICS GREEN BOTTOM LINE, 2000, pp. 305-310
Citation: W. Trumble et P. Lawless, Case study: A search for chromate conversion coating alternatives for corrosion protection of zinc-plated electronic shelves, GREEN ELECTRONICS GREEN BOTTOM LINE, 2000, pp. 311-314