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Table of contents of journal: *Microscale thermophysical engineering (Print)

Results: 1-25/56

Authors: DRESSELHAUS MS
Citation: Ms. Dresselhaus, LOW-DIMENSIONAL THERMOELECTRICITY, Microscale thermophysical engineering (Print), 2(4), 1998, pp. 223-243

Authors: TANG KK BUCKIUS RO
Citation: Kk. Tang et Ro. Buckius, BIDIRECTIONAL REFLECTION MEASUREMENTS FROM 2-DIMENSIONAL MICROCONTOURED METALLIC SURFACES, Microscale thermophysical engineering (Print), 2(4), 1998, pp. 245-260

Authors: LONGTIN JP FAN CH
Citation: Jp. Longtin et Ch. Fan, PRECISION LASER-BASED CONCENTRATION AND REFRACTIVE-INDEX MEASUREMENT OF LIQUIDS, Microscale thermophysical engineering (Print), 2(4), 1998, pp. 261-272

Authors: MORINI GL SPIGA M
Citation: Gl. Morini et M. Spiga, SLIP-FLOW IN RECTANGULAR MICROTUBES, Microscale thermophysical engineering (Print), 2(4), 1998, pp. 273-282

Authors: MA HB PETERSON GP PRATT DM
Citation: Hb. Ma et al., DISJOINING PRESSURE EFFECT ON THE WETTING CHARACTERISTICS IN A CAPILLARY-TUBE, Microscale thermophysical engineering (Print), 2(4), 1998, pp. 283-297

Authors: TIEN CL LUKES JR CHOU FC
Citation: Cl. Tien et al., MOLECULAR-DYNAMICS SIMULATION OF THERMAL TRANSPORT IN SOLIDS, Microscale thermophysical engineering, 2(3), 1998, pp. 133-137

Authors: NAUMAN EA CHANG WCW SATCHER RL KEAVENY TM
Citation: Ea. Nauman et al., MICROSCALE ENGINEERING APPLICATIONS IN BONE ADAPTATION, Microscale thermophysical engineering, 2(3), 1998, pp. 139-172

Authors: GARIMELLA SV SIMPSON JE
Citation: Sv. Garimella et Je. Simpson, INTERFACE PROPAGATION IN THE PROCESSING OF METAL-MATRIX COMPOSITES, Microscale thermophysical engineering, 2(3), 1998, pp. 173-188

Authors: WEBB RL ZHANG M
Citation: Rl. Webb et M. Zhang, HEAT-TRANSFER AND FRICTION IN SMALL-DIAMETER CHANNELS, Microscale thermophysical engineering, 2(3), 1998, pp. 189-202

Authors: MAJUMDAR A MEZIC I
Citation: A. Majumdar et I. Mezic, STABILITY REGIMES OF THIN LIQUID-FILMS, Microscale thermophysical engineering, 2(3), 1998, pp. 203-213

Authors: MAJUMDAR A TIEN CL
Citation: A. Majumdar et Cl. Tien, MICRO POWER DEVICES, Microscale thermophysical engineering, 2(2), 1998, pp. 67-69

Authors: LIN LW
Citation: Lw. Lin, MICROSCALE THERMAL BUBBLE FORMATION - THERMOPHYSICAL PHENOMENA AND APPLICATIONS, Microscale thermophysical engineering, 2(2), 1998, pp. 71-85

Authors: HIPWELL MC TIEN CL MAO XL RUSSO RE
Citation: Mc. Hipwell et al., PICOSECOND DIFFERENTIAL TRANSMISSION MEASUREMENTS ON POROUS SILICON, Microscale thermophysical engineering, 2(2), 1998, pp. 87-99

Authors: JU YS KURABAYASHI K GOODSON KE
Citation: Ys. Ju et al., THERMAL CHARACTERIZATION OF IC PASSIVATION LAYERS USING JOULE HEATINGAND OPTICAL THERMOMETRY, Microscale thermophysical engineering, 2(2), 1998, pp. 101-110

Authors: GUO ZY WU XB
Citation: Zy. Guo et Xb. Wu, FURTHER STUDY ON COMPRESSIBILITY EFFECTS ON THE GAS-FLOW AND HEAT-TRANSFER IN A MICROTUBE, Microscale thermophysical engineering, 2(2), 1998, pp. 111-120

Authors: PETERSON RB
Citation: Rb. Peterson, SIZE LIMITS FOR REGENERATIVE HEAT ENGINES, Microscale thermophysical engineering, 2(2), 1998, pp. 121-131

Authors: TIEN CL
Citation: Cl. Tien, MICROSCALE THERMOPHYSICAL ENGINEERING, Microscale thermophysical engineering, 2(1), 1998, pp. 3-4

Authors: MAJUMDAR A
Citation: A. Majumdar, LOWER LIMIT OF THERMAL-CONDUCTIVITY - DIFFUSION VERSUS LOCALIZATION, Microscale thermophysical engineering, 2(1), 1998, pp. 5-9

Authors: ALLEN LH LAI SL
Citation: Lh. Allen et Sl. Lai, MEMS-BASED SCANNING CALORIMETER FOR THERMODYNAMIC PROPERTIES OF NANOSTRUCTURES, Microscale thermophysical engineering, 2(1), 1998, pp. 11-19

Authors: BENSON DA MITCHELL RT TUCK MR PALMER DW PETERSON GP
Citation: Da. Benson et al., ULTRAHIGH-CAPACITY MICROMACHINED HEAT SPREADERS, Microscale thermophysical engineering, 2(1), 1998, pp. 21-30

Authors: LEE SM MATAMIS G CAHILL DG ALLEN WP
Citation: Sm. Lee et al., THIN-FILM MATERIALS AND MINIMUM THERMAL-CONDUCTIVITY, Microscale thermophysical engineering, 2(1), 1998, pp. 31-36

Authors: SHAKOURI A LEE EY SMITH DL NARAYANAMURTI V BOWERS JE
Citation: A. Shakouri et al., THERMOELECTRIC EFFECTS IN SUBMICRON HETEROSTRUCTURE BARRIERS, Microscale thermophysical engineering, 2(1), 1998, pp. 37-47

Authors: MARUYAMA S KURASHIGE T MATSUMOTO S YAMAGUCHI Y KIMURA T
Citation: S. Maruyama et al., LIQUID DROPLET IN CONTACT WITH A SOLID-SURFACE, Microscale thermophysical engineering, 2(1), 1998, pp. 49-62

Authors: CHEN G GOODSON KE GRIGOROPOULOS C HIPWELL MC LIEPMANN D MAJUMDAR A MARUYAMA S THUNDAT T TIEN CL TIEN NC
Citation: G. Chen et al., REPORT OF WORKSHOP - THERMOPHYSICAL PHENOMENA IN MICROSCALE SENSORS, DEVICES, AND STRUCTURES, Microscale thermophysical engineering, 1(4), 1997, pp. 267-274

Authors: TIEN NC
Citation: Nc. Tien, SILICON MICROMACHINED THERMAL SENSORS AND ACTUATORS (REPRINTED FROM MICROSCALE ENERGY-TRANSPORT, 1997), Microscale thermophysical engineering, 1(4), 1997, pp. 275-292
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