Citation: Wp. Seneviratne et Js. Tomblin, Adaptation of the Iosipescu in-plane shear test method for high strength textile composites, J COMP TECH, 23(4), 2001, pp. 259-266
Authors:
Paris, I
Bennett, R
Mager, M
Poursartip, A
Citation: I. Paris et al., A technique for measuring delamination crack tip behavior in composite materials inside a scanning electron microscope, J COMP TECH, 23(3), 2001, pp. 165-177
Citation: Dh. Mollenhauer et Kl. Reifsnider, Interlaminar deformation along the cylindrical surface of a hole in laminated composites - Experimental analysis by moire interferometry, J COMP TECH, 23(3), 2001, pp. 178-188
Citation: Jt. South et al., Strain rate and temperature effects on the mechanical properties of an E-glass/vinyl ester composite system, J COMP TECH, 23(3), 2001, pp. 189-196
Citation: R. John et Dj. Buchanan, Bridging stress distributions during fatigue crack growth in continuously reinforced [0] metal matrix composites, J COMP TECH, 23(2), 2001, pp. 69-81
Citation: K. Van De Velde et P. Kiekens, Effects of chemical environments on pultruded E-glass reinforced polyesters, J COMP TECH, 23(2), 2001, pp. 92-101
Citation: E. Capello et V. Tagliaferri, Drilling damage of GFRP and residual mechanical behavior - Part 1: Drilling damage generation, J COMP TECH, 23(2), 2001, pp. 122-130
Citation: E. Capello et V. Tagliaferri, Drilling damage of GFRP and residual mechanical behavior - Part II: Staticand cyclic bearing loads, J COMP TECH, 23(2), 2001, pp. 131-137
Authors:
Walther, MB
Reifsnider, KL
Madhukar, M
Genidy, MS
Citation: Mb. Walther et al., Single-fiber fragmentations of AS-4 carbon fiber embedded in Epon 828 under the effect of elevated temperatures, J COMP TECH, 23(1), 2001, pp. 36-41
Citation: Ka. Lubke et al., Effect of environment on fracture toughness and debond growth of aluminum/FM (R) 73/boron-epoxy adhesively bonded joints, J COMP TECH, 23(1), 2001, pp. 42-49
Citation: Ce. Bakis, Preamble to the collection of papers based on presentations given at the symposium on durability of composites, dedicated in honor of Professor Kenneth L. Reifsnider of Virginia Tech, J COMP TECH, 22(4), 2000, pp. 175-176