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Results: 51-75/458
Authors:
SWINGLER J
MCBRIDE JW
Citation: J. Swingler et Jw. Mcbride, MODELING OF ENERGY-TRANSPORT IN ARCING ELECTRICAL CONTACTS TO DETERMINE MASS-LOSS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 54-60
Authors:
MCBRIDE JW
WEAVER PM
JEFFERY PA
Citation: Jw. Mcbride et al., ARE ROOT MOBILITY DURING CONTACT OPENING AT HIGH-CURRENT, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 61-67
Authors:
TAKEUCHI M
KUBONO T
Citation: M. Takeuchi et T. Kubono, THE SPATIAL DISTRIBUTIONS OF SPECTRAL INTENSITY AND TEMPERATURE IN THE CROSS-SECTION OF AN ARC COLUMN BETWEEN SEPARATING PD CONTACTS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 68-75
Authors:
SCHNEEGANS O
HOUZE F
MEYER R
BOYER L
Citation: O. Schneegans et al., STUDY OF THE LOCAL ELECTRICAL-PROPERTIES OF METAL-SURFACES USING AN AFM WITH A CONDUCTING PROBE, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 76-81
Authors:
GAUSTER E
RIEDER W
Citation: E. Gauster et W. Rieder, ARC LENGTHENING BETWEEN DIVERGENT RUNNERS - INFLUENCE OF ARC CURRENT,GEOMETRY, AND MATERIALS OF RUNNERS AND WALLS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 82-95
Authors:
KARETTA F
LINDMAYER M
Citation: F. Karetta et M. Lindmayer, SIMULATION OF THE GASDYNAMIC AND ELECTROMAGNETIC PROCESSES IN LOW-VOLTAGE SWITCHING ARCS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 96-103
Authors:
PARRY J
ROSTEN H
KROMANN GB
Citation: J. Parry et al., THE DEVELOPMENT OF COMPONENT-LEVEL THERMAL COMPACT MODELS OF A C4 CBGA INTERCONNECT TECHNOLOGY - THE MOTOROLA POWERPC-603 AND POWERPC-604 RISC MICROPROCESSORS/, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 104-112
Authors:
CAO LP
KRUSIUS JP
KORHONEN MA
FISHER TS
Citation: Lp. Cao et al., TRANSIENT THERMAL MANAGEMENT OF PORTABLE ELECTRONICS USING HEAT-STORAGE AND DYNAMIC POWER DISSIPATION CONTROL, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 113-123
ON THE POSITIVE TEMPERATURE-DEPENDENCE OF THE THERMAL-CONDUCTIVITY OFA DIAMOND-BASED HEAT SINK PASTE
Authors:
HASSELMAN DPH
DONALDSON KY
Citation: Dph. Hasselman et Ky. Donaldson, ON THE POSITIVE TEMPERATURE-DEPENDENCE OF THE THERMAL-CONDUCTIVITY OFA DIAMOND-BASED HEAT SINK PASTE, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 124-126
Authors:
SHEN YL
Citation: Yl. Shen, EFFECTS OF PREEXISTING INTERFACIAL DEFECTS ON THE STRESS PROFILE IN ALUMINUM INTERCONNECTION LINES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 127-131
Authors:
SCHAIBLE B
LEE YC
XIE H
Citation: B. Schaible et al., EFFICIENT DESIGN USING FUZZY-LOGIC BASED REGRESSION-MODELS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 132-141
Authors:
QUEIPO NV
HUMPHREY JAC
ORTEGA A
Citation: Nv. Queipo et al., MULTIOBJECTIVE OPTIMAL PLACEMENT OF CONVECTIVELY COOLED ELECTRONIC COMPONENTS ON PRINTED WIRING BOARDS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 142-153
Authors:
DELANGHE P
CRIEL S
CEUTERICK D
Citation: P. Delanghe et al., GREEN DESIGN OF TELECOM PRODUCTS - THE ADSL HIGH-SPEED MODEM AS A CASE-STUDY, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 154-167
Authors:
YOVANOVICH MM
CULHAM JR
TEERTSTRA P
Citation: Mm. Yovanovich et al., ANALYTICAL MODELING OF SPREADING RESISTANCE IN FLUX TUBES, HALF-SPACES, AND COMPOUND DISKS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 168-176
Authors:
VANDEVELDE B
CHRISTIAENS F
BEYNE E
ROGGEN J
PEETERS J
ALLAERT K
VANDEPITTE D
BERGMANS J
Citation: B. Vandevelde et al., THERMOMECHANICAL MODELS FOR LEADLESS SOLDER INTERCONNECTIONS IN FLIP-CHIP ASSEMBLIES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 177-185
Authors:
KING WW
STEPHENSON DL
Citation: Ww. King et Dl. Stephenson, MODULAR ADAPTERS FOR FIBER OPTICS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 186-191
Authors:
PECHT MG
Citation: Mg. Pecht, ELECTRONIC PACKAGING - CROSS-DISCIPLINE IS THE ONLY DISCIPLINE, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 192-194
Authors:
Braunovic, M
Citation: M. Braunovic, Contributions from the 43rd IEEE Holm Conference on Electrical Contacts - Foreword, IEEE COM A, 21(4), 1998, pp. 529-529
Authors:
Dervos, CT
Michaelides, JM
Citation: Ct. Dervos et Jm. Michaelides, The effect of contact capacitance on current-voltage characteristics of stationary metal contacts, IEEE COM A, 21(4), 1998, pp. 530-540
Authors:
Dervos, CT
Michaelides, JM
Citation: Ct. Dervos et Jm. Michaelides, The effect of ion neutralization processes on interfacial energy of stationary contacts, IEEE COM A, 21(4), 1998, pp. 541-548
Authors:
Gauster, E
Rieder, W
Citation: E. Gauster et W. Rieder, Arc restrikes yielding back-commutations in the contact gap of low voltageinterrupters, IEEE COM A, 21(4), 1998, pp. 549-555
Authors:
Shea, JJ
Citation: Jj. Shea, Modeling contact erosion in three phase vacuum contactors, IEEE COM A, 21(4), 1998, pp. 556-564
Authors:
Christiaens, F
Vandevelde, B
Beyne, E
Mertens, R
Berghmans, J
Citation: F. Christiaens et al., A generic methodology for deriving compact dynamic thermal models, appliedto the PSGA package, IEEE COM A, 21(4), 1998, pp. 565-576
Authors:
Gektin, V
Bar-Cohen, A
Witzman, S
Citation: V. Gektin et al., Coffin-Manson based fatigue analysis of underfilled DCAs, IEEE COM A, 21(4), 1998, pp. 577-584
Authors:
Tan, CM
Er, E
Hua, Y
Chai, V
Citation: Cm. Tan et al., Failure analysis of bond pad metal peeling using FIB and AFM, IEEE COM A, 21(4), 1998, pp. 585-591