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Results:
1-3
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Results: 3
Electrical characteristics of silicon-nodule-related via failures observedin aluminum-silicon interconnects
Authors:
Itsumi, M Ohfuji, S Akiya, H Nakayama, S Yoshino, H
Citation:
M. Itsumi et al., Electrical characteristics of silicon-nodule-related via failures observedin aluminum-silicon interconnects, J SOL ST EL, 4(3), 2000, pp. 125-130
The influence of stud bumping above the MOSFETs on device reliability
Authors:
Shimoyama, N Machida, K Shimaya, M Akiya, H Kyuragi, H
Citation:
N. Shimoyama et al., The influence of stud bumping above the MOSFETs on device reliability, IEICE T FUN, E83A(5), 2000, pp. 851-856
Evaluation of substrate (Ni)-catalyzed electroless gold plating process
Authors:
Osaka, T Misato, T Sato, J Akiya, H Homma, T Kato, M Okinaka, Y Yoshioka, O
Citation:
T. Osaka et al., Evaluation of substrate (Ni)-catalyzed electroless gold plating process, J ELCHEM SO, 147(3), 2000, pp. 1059-1064
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