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Citation: V. Videkov et al., New assembling technique for BGA packages without thermal processes, MICROEL REL, 41(4), 2001, pp. 611-615

Authors: Gospodinova, M Mollov, VS Arnaudov, R Philippov, P

Citation: M. Gospodinova et al., Study of the DC biasing effect on insertion losses in high-frequency interconnections, MICROELEC J, 31(11-12), 2000, pp. 1009-1014