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Results: 1-19 |
Results: 19
NARROWING THE GAP IN FLIP CHIPS - UNDERFILLING BETWEEN THE CHIP AND SUBSTRATE REDUCES SOLDER-JOINT DEFORMATION AND SHEAR STRAIN
Authors: GEKTIN V BARCOHEN A
Citation: V. Gektin et A. Barcohen, NARROWING THE GAP IN FLIP CHIPS - UNDERFILLING BETWEEN THE CHIP AND SUBSTRATE REDUCES SOLDER-JOINT DEFORMATION AND SHEAR STRAIN, IEEE circuits and devices magazine, 14(3), 1998, pp. 29-33
THERMAL CHARACTERIZATION OF CHIP PACKAGES - EVOLUTIONARY DEVELOPMENT OF COMPACT MODELS
Authors: BARCOHEN A KRUEGER WB
Citation: A. Barcohen et Wb. Krueger, THERMAL CHARACTERIZATION OF CHIP PACKAGES - EVOLUTIONARY DEVELOPMENT OF COMPACT MODELS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 399-410
COFFIN-MANSON FATIGUE MODEL OF UNDERFILLED FLIP-CHIPS
Authors: GEKTIN V BARCOHEN A AMES J
Citation: V. Gektin et al., COFFIN-MANSON FATIGUE MODEL OF UNDERFILLED FLIP-CHIPS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(3), 1997, pp. 317-326
COMBINED PRESSURE AND SUBCOOLING EFFECTS ON POOL BOILING FROM A PPGA CHIP PACKAGE
Authors: WATWE AA BARCOHEN A MCNEIL A
Citation: Aa. Watwe et al., COMBINED PRESSURE AND SUBCOOLING EFFECTS ON POOL BOILING FROM A PPGA CHIP PACKAGE, Journal of electronic packaging, 119(2), 1997, pp. 95-105
POOL BOILING HEAT-TRANSFER WITH AN ARRAY OF FLUSH-MOUNTED, SQUARE HEATERS ON A VERTICAL SURFACE
Authors: YOU SM SIMON TW BARCOHEN A
Citation: Sm. You et al., POOL BOILING HEAT-TRANSFER WITH AN ARRAY OF FLUSH-MOUNTED, SQUARE HEATERS ON A VERTICAL SURFACE, Journal of electronic packaging, 119(1), 1997, pp. 17-25
HEAT-TRANSFER - A REVIEW OF 1994 LITERATURE
Authors: ECKERT ERG GOLDSTEIN RJ IBELE WE PATANKAR SV SIMON TW STRYKOWSKI PJ TAMMA KK KUEHN TH BARCOHEN A HEBERLEIN JVR HOFELDT DL DAVIDSON JH BISCHOF J KULACKI F
Citation: Erg. Eckert et al., HEAT-TRANSFER - A REVIEW OF 1994 LITERATURE, International journal of heat and mass transfer, 40(16), 1997, pp. 3729-3804
EVAPORATIVE COOLING OF ELECTRONIC EQUIPMENT - FOREWORD
Authors: KABOV OA BARCOHEN A
Citation: Oa. Kabov et A. Barcohen, EVAPORATIVE COOLING OF ELECTRONIC EQUIPMENT - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(2), 1996, pp. 150-150
UNTITLED
Authors: BARCOHEN A
Citation: A. Barcohen, UNTITLED, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(1), 1996, pp. 2-3
NAVIER-STOKES STUDY OF NATURAL-CONVECTION AND HEAT-TRANSFER IN VERTICAL SYMMETRICALLY HEATED PLATE-FIN HEAT SINKS
Authors: NICULIN D STRELETS M DVINSKY A BARCOHEN A
Citation: D. Niculin et al., NAVIER-STOKES STUDY OF NATURAL-CONVECTION AND HEAT-TRANSFER IN VERTICAL SYMMETRICALLY HEATED PLATE-FIN HEAT SINKS, Numerical heat transfer. Part A, Applications, 30(7), 1996, pp. 703-720
PROFESSOR BERGLES,ARTHUR,E. ON HIS 60TH BIRTHDAY
Authors: JENSEN MK MANGLIK RM BARCOHEN A HARTNETT JP MINKOWYCZ WJ
Citation: Mk. Jensen et al., PROFESSOR BERGLES,ARTHUR,E. ON HIS 60TH BIRTHDAY, International journal of heat and mass transfer, 39(10), 1996, pp. 2007-2008
GAS-ASSISTED EVAPORATIVE COOLING OF HIGH-DENSITY ELECTRONIC MODULES
Authors: BARCOHEN A SHERWOOD G HODES M SOLBREKEN G
Citation: A. Barcohen et al., GAS-ASSISTED EVAPORATIVE COOLING OF HIGH-DENSITY ELECTRONIC MODULES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(3), 1995, pp. 502-509
A SHEAR-BASED OPTIMIZATION OF ADHESIVE THICKNESS FOR DIE BONDING
Authors: HOKANSON KE BARCOHEN A
Citation: Ke. Hokanson et A. Barcohen, A SHEAR-BASED OPTIMIZATION OF ADHESIVE THICKNESS FOR DIE BONDING, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(3), 1995, pp. 578-584
THERMAL FOCUS - FOREWORD
Authors: BARCOHEN A
Citation: A. Barcohen, THERMAL FOCUS - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(1), 1995, pp. 74-74
THERMAL PERFORMANCE OF A PASSIVE IMMERSION-COOLING MULTICHIP-MODULE
Authors: KITCHING D OGATA T BARCOHEN A
Citation: D. Kitching et al., THERMAL PERFORMANCE OF A PASSIVE IMMERSION-COOLING MULTICHIP-MODULE, Journal of enhanced heat transfer, 2(1-2), 1995, pp. 95-103
MECHANICAL-ENGINEERING IN THE INFORMATION AGE
Authors: BARCOHEN A
Citation: A. Barcohen, MECHANICAL-ENGINEERING IN THE INFORMATION AGE, Mechanical engineering, 117(12), 1995, pp. 66-70
EFFECTS OF DISSOLVED-GAS CONTENT ON POOL BOILING OF A HIGHLY WETTING FLUID
Authors: YOU SM SIMON TW BARCOHEN A HONG YS
Citation: Sm. You et al., EFFECTS OF DISSOLVED-GAS CONTENT ON POOL BOILING OF A HIGHLY WETTING FLUID, Journal of heat transfer, 117(3), 1995, pp. 687-692
THERMAL PERFORMANCE OF AN INTEGRAL IMMERSION COOLED MULTICHIP-MODULE PACKAGE
Authors: NELSON RD SOMMERFELDT S BARCOHEN A
Citation: Rd. Nelson et al., THERMAL PERFORMANCE OF AN INTEGRAL IMMERSION COOLED MULTICHIP-MODULE PACKAGE, IEEE transactions on components, packaging, and manufacturing technology. Part A, 17(3), 1994, pp. 405-412
HEAT-TRANSFER - A REVIEW OF 1992 LITERATURE
Authors: ECKERT ERG GOLDSTEIN RJ IBELE WE PATANKAR SV SIMON TW STRYKOWSKI PJ TAMMA KK BARCOHEN A HEBERLEIN JVR HOFELDT DL KUEHN TH STELSON KA
Citation: Erg. Eckert et al., HEAT-TRANSFER - A REVIEW OF 1992 LITERATURE, International journal of heat and mass transfer, 37(9), 1994, pp. 1285-1375
THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS WITH DIELECTRIC LIQUIDS
Authors: BARCOHEN A
Citation: A. Barcohen, THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS WITH DIELECTRIC LIQUIDS, JSME international journal. Series B, fluids and thermal engineering, 36(1), 1993, pp. 1-25
Risultati: 1-19 |