EVAPORATIVE COOLING OF ELECTRONIC EQUIPMENT - FOREWORD

Citation
Oa. Kabov et A. Barcohen, EVAPORATIVE COOLING OF ELECTRONIC EQUIPMENT - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(2), 1996, pp. 150-150
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
ISSN journal
10709886
Volume
19
Issue
2
Year of publication
1996
Pages
150 - 150
Database
ISI
SICI code
1070-9886(1996)19:2<150:ECOEE->2.0.ZU;2-2