Citation: S. Mulgaonker et Hm. Berg, THERMAL SENSITIVITY ANALYSIS FOR THE 119-PBGA - A FRAMEWORK FOR RAPIDPROTOTYPING (VOL 19, PG 66, 1996), IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(2), 1996, pp. 279-279
Citation: S. Mulgaonker et Hm. Berg, THERMAL SENSITIVITY ANALYSIS FOR THE 119 PBGA - A FRAMEWORK FOR RAPIDPROTOTYPING, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(1), 1996, pp. 66-75
Citation: Sa. Spiro et Hm. Berg, APPLYING THE ENDOSCOPIC STAPLER IN EXCISION OF ZENKER DIVERTICULUM - A SOLUTION FOR 2 INTRAOPERATIVE PROBLEMS, Otolaryngology and head and neck surgery, 110(6), 1994, pp. 603-604
Citation: Gs. Ganesan et Hm. Berg, MODEL AND ANALYSES FOR SOLDER REFLOW CRACKING PHENOMENON IN SMT PLASTIC PACKAGES, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 940-948