Authors: PATEL KS KOHL PA BIDSTRUPALLEN SA

Citation: Ks. Patel et al., NOVEL TECHNIQUE FOR MEASURING THROUGH-PLANE MODULUS IN THIN POLYMER-FILMS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(2), 1998, pp. 199-202

Authors: HODGE TC BIDSTRUPALLEN SA KOHL PA

Citation: Tc. Hodge et al., STRESSES IN THIN-FILM METALLIZATION, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(2), 1997, pp. 241-250