Authors:
BOLCHINI C
BUONANNO G
FERRANDI F
SCIUTO D
BOMBANA M
CAVALLORO P
Citation: C. Bolchini et al., A WAFER LEVEL TESTABILITY APPROACH BASED ON AN IMPROVED SCAN INSERTION TECHNIQUE, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(3), 1995, pp. 438-447