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Results: 1-12 |
Results: 12
SIMULATING THE IMPACT OF PATTERN-DEPENDENT POLY-CD VARIATION ON CIRCUIT PERFORMANCE
Authors: STINE BE BONING DS CHUNG JE CIPLICKAS DJ KIBARIAN JK
Citation: Be. Stine et al., SIMULATING THE IMPACT OF PATTERN-DEPENDENT POLY-CD VARIATION ON CIRCUIT PERFORMANCE, IEEE transactions on semiconductor manufacturing, 11(4), 1998, pp. 552-556
RUN BY RUN ADVANCED PROCESS-CONTROL OF METAL SPUTTER-DEPOSITION
Authors: SMITH TH BONING DS STEFANI J BUTLER SW
Citation: Th. Smith et al., RUN BY RUN ADVANCED PROCESS-CONTROL OF METAL SPUTTER-DEPOSITION, IEEE transactions on semiconductor manufacturing, 11(2), 1998, pp. 276-284
RAPID CHARACTERIZATION AND MODELING OF PATTERN-DEPENDENT VARIATION INCHEMICAL-MECHANICAL POLISHING
Authors: STINE BE OUMA DO DIVECHA RR BONING DS CHUNG JE HETHERINGTON DL HARWOOD CR NAKAGAWA OS OH SY
Citation: Be. Stine et al., RAPID CHARACTERIZATION AND MODELING OF PATTERN-DEPENDENT VARIATION INCHEMICAL-MECHANICAL POLISHING, IEEE transactions on semiconductor manufacturing, 11(1), 1998, pp. 129-140
THE PHYSICAL AND ELECTRICAL EFFECTS OF METAL-FILL PATTERNING PRACTICES FOR OXIDE CHEMICAL-MECHANICAL POLISHING PROCESSES
Authors: STINE BE BONING DS CHUNG JE CAMILLETTI L KRUPPA F EQUI ER LOH W PRASAD S MUTHUKRISHNAN M TOWERY D BERMAN M KAPOOR A
Citation: Be. Stine et al., THE PHYSICAL AND ELECTRICAL EFFECTS OF METAL-FILL PATTERNING PRACTICES FOR OXIDE CHEMICAL-MECHANICAL POLISHING PROCESSES, I.E.E.E. transactions on electron devices, 45(3), 1998, pp. 665-679
A NOVEL STATISTICAL METROLOGY FRAMEWORK FOR IDENTIFYING SOURCES OF VARIATION IN OXIDE CHEMICAL-MECHANICAL POLISHING
Authors: DIVECHA RR STINE BE OUMA DO CHANG EC BONING DS CHUNG JE NAKAGAWA OS AOKI H RAY G BRADBURY D OH SY
Citation: Rr. Divecha et al., A NOVEL STATISTICAL METROLOGY FRAMEWORK FOR IDENTIFYING SOURCES OF VARIATION IN OXIDE CHEMICAL-MECHANICAL POLISHING, Journal of the Electrochemical Society, 145(3), 1998, pp. 1052-1059
ANALYSIS AND DECOMPOSITION OF SPATIAL VARIATION IN INTEGRATED-CIRCUITPROCESSES AND DEVICES
Authors: STINE BE BONING DS CHUNG JE
Citation: Be. Stine et al., ANALYSIS AND DECOMPOSITION OF SPATIAL VARIATION IN INTEGRATED-CIRCUITPROCESSES AND DEVICES, IEEE transactions on semiconductor manufacturing, 10(1), 1997, pp. 24-41
ARTIFICIAL NEURAL-NETWORK EXPONENTIALLY WEIGHTED MOVING AVERAGE CONTROLLER FOR SEMICONDUCTOR PROCESSES
Authors: SMITH TH BONING DS
Citation: Th. Smith et Ds. Boning, ARTIFICIAL NEURAL-NETWORK EXPONENTIALLY WEIGHTED MOVING AVERAGE CONTROLLER FOR SEMICONDUCTOR PROCESSES, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 15(3), 1997, pp. 1377-1384
END-POINT PREDICTION FOR POLYSILICON PLASMA ETCH VIA OPTICAL-EMISSIONINTERFEROMETRY
Authors: WONG K BONING DS SAWIN HH BUTLER SW SACHS EM
Citation: K. Wong et al., END-POINT PREDICTION FOR POLYSILICON PLASMA ETCH VIA OPTICAL-EMISSIONINTERFEROMETRY, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 15(3), 1997, pp. 1403-1408
USE OF SHORT-LOOP ELECTRICAL MEASUREMENTS FOR YIELD IMPROVEMENT
Authors: YU C MAUNG TD SPANOS CJ BONING DS CHUNG JE LIU HY CHANG KJ BARTELINK DJ
Citation: C. Yu et al., USE OF SHORT-LOOP ELECTRICAL MEASUREMENTS FOR YIELD IMPROVEMENT, IEEE transactions on semiconductor manufacturing, 8(2), 1995, pp. 150-159
DOE OPT - A SYSTEM FOR DESIGN OF EXPERIMENTS, RESPONSE-SURFACE MODELING, AND OPTIMIZATION USING PROCESS AND DEVICE SIMULATION/
Authors: BONING DS MOZUMDER PK
Citation: Ds. Boning et Pk. Mozumder, DOE OPT - A SYSTEM FOR DESIGN OF EXPERIMENTS, RESPONSE-SURFACE MODELING, AND OPTIMIZATION USING PROCESS AND DEVICE SIMULATION/, IEEE transactions on semiconductor manufacturing, 7(2), 1994, pp. 233-244
SEMICONDUCTOR WAFER REPRESENTATION FOR TCAD
Authors: GILES MD BONING DS CHIN GR DIETRICH WC KARASICK MS LAW ME MOZUMDER PK NACKMAN LR RAJAN VT WALKER DMH WANG RH WONG AS
Citation: Md. Giles et al., SEMICONDUCTOR WAFER REPRESENTATION FOR TCAD, IEEE transactions on computer-aided design of integrated circuits and systems, 13(1), 1994, pp. 82-95
A SYSTEM FOR SEMICONDUCTOR PROCESS SPECIFICATION
Authors: DURBECK D CHERN JH BONING DS
Citation: D. Durbeck et al., A SYSTEM FOR SEMICONDUCTOR PROCESS SPECIFICATION, IEEE transactions on semiconductor manufacturing, 6(4), 1993, pp. 297-305
Risultati: 1-12 |