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Authors: BUJARD P KUHNLEIN G INO S SHIOBARA T
Citation: P. Bujard et al., THERMAL-CONDUCTIVITY OF MOLDING COMPOUNDS FOR PLASTIC PACKAGING, IEEE transactions on components, packaging, and manufacturing technology. Part A, 17(4), 1994, pp. 527-532

Authors: DIETLER G HEUBERGER M TRESCH S BUJARD P
Citation: G. Dietler et al., AN INVESTIGATION OF DOPED POLYPYRROLE BY A COMBINATION OF SCANNING TUNNELING AND ATOMIC-FORCE MICROSCOPES, Synthetic metals, 67(1-3), 1994, pp. 211-214

Authors: CHAUVET O PASCHEN S FORRO L ZUPPIROLI L BUJARD P KAI K WERNET W
Citation: O. Chauvet et al., MAGNETIC AND TRANSPORT-PROPERTIES OF POLYPYRROLE DOPED WITH POLYANIONS, Synthetic metals, 63(2), 1994, pp. 115-119
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