Authors: Kim, HS Ko, DH Bae, DL Fujihara, K Kang, HK

Citation: Hs. Kim et al., The formation of Ti-polycide gate structure with high thermal stability using chemical-mechanical polishing (CMP) planarization technology, IEEE ELEC D, 20(2), 1999, pp. 86-88

Authors: Kwon, Y Lee, C Kang, HK Bae, DL

Citation: Y. Kwon et al., Silicidation of Co/Ti, Co/Nb, and Co Hf bilayers on the Si (100) substrate, J KOR PHYS, 34, 1999, pp. S499-S503