Authors: Li, XX Bao, MH

Citation: Xx. Li et Mh. Bao, Micromachining of multi-thickness sensor-array structures with dual-stage etching technology, J MICROM M, 11(3), 2001, pp. 239-244

Authors: Li, XX Lin, RM Miao, JM Bao, MH

Citation: Xx. Li et al., Study on convex-corner undercutting formed by masked-maskless etching in aqueous KOH, J MICROM M, 10(3), 2000, pp. 309-313

Authors: Bao, MH Yang, H Yin, H Shen, SQ

Citation: Mh. Bao et al., Effects of electrostatic forces generated by the driving signal on capacitive sensing devices, SENS ACTU-A, 84(3), 2000, pp. 213-219

Authors: Yang, H Bao, MH Shen, SQ Li, XX Zhang, DC Wu, GY

Citation: H. Yang et al., A novel technique for measuring etch rate distribution of Si, SENS ACTU-A, 79(2), 2000, pp. 136-140

Authors: Li, XX Yang, H Bao, MH Shen, SQ Wang, WY

Citation: Xx. Li et al., (100) composite beam structure formed by masked-maskless etch of silicon, J MICROM M, 9(3), 1999, pp. 264-269

Authors: Li, XX Bao, MH Yang, H Shen, SQ Lu, DR

Citation: Xx. Li et al., A micromachined piezoresistive angular rate sensor with a composite beam structure, SENS ACTU-A, 72(3), 1999, pp. 217-223