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Results:
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Results: 2
Reliability testing of high-power multi-chip IGBT modules
Authors:
Lefranc, G Licht, T Schultz, HJ Beinert, R Mitic, G
Citation:
G. Lefranc et al., Reliability testing of high-power multi-chip IGBT modules, MICROEL REL, 40(8-10), 2000, pp. 1659-1663
Reliability of AlN substrates and their solder joints in IGBT power modules
Authors:
Mitic, G Beinert, R Klofac, P Schultz, HJ Lefranc, G
Citation:
G. Mitic et al., Reliability of AlN substrates and their solder joints in IGBT power modules, MICROEL REL, 39(6-7), 1999, pp. 1159-1164
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