Authors: Wong, CP Bollampally, RS

Citation: Cp. Wong et Rs. Bollampally, Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging, IEEE T AD P, 22(1), 1999, pp. 54-59

Authors: Wong, CP Bollampally, RS

Citation: Cp. Wong et Rs. Bollampally, Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging, J APPL POLY, 74(14), 1999, pp. 3396-3403