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Results: 1-9 |
Results: 9
A CVD EPITAXIAL DEPOSITION IN A VERTICAL BARREL REACTOR - PROCESS MODELING USING CLUSTER-BASED FUZZY-LOGIC MODELS
Authors: CHIOU JC YANG JY
Citation: Jc. Chiou et Jy. Yang, A CVD EPITAXIAL DEPOSITION IN A VERTICAL BARREL REACTOR - PROCESS MODELING USING CLUSTER-BASED FUZZY-LOGIC MODELS, IEEE transactions on semiconductor manufacturing, 11(4), 1998, pp. 645-653
CONSTRAINT VIOLATION STABILIZATION USING INPUT-OUTPUT FEEDBACK LINEARIZATION IN MULTIBODY DYNAMIC ANALYSIS
Authors: CHIOU JC WU SD
Citation: Jc. Chiou et Sd. Wu, CONSTRAINT VIOLATION STABILIZATION USING INPUT-OUTPUT FEEDBACK LINEARIZATION IN MULTIBODY DYNAMIC ANALYSIS, Journal of guidance, control, and dynamics, 21(2), 1998, pp. 222-228
OPEN NEWTON-COTES DIFFERENTIAL METHODS AS MULTILAYER SYMPLECTIC INTEGRATORS
Authors: CHIOU JC WU SD
Citation: Jc. Chiou et Sd. Wu, OPEN NEWTON-COTES DIFFERENTIAL METHODS AS MULTILAYER SYMPLECTIC INTEGRATORS, The Journal of chemical physics, 107(17), 1997, pp. 6894-6898
ROBUST ATTITUDE-CONTROL OF SPACECRAFT USING SLIDING MODE CONTROL AND PRODUCTIVE NETWORKS
Authors: CHIOU JC HWANG MC WU SD YANG JY
Citation: Jc. Chiou et al., ROBUST ATTITUDE-CONTROL OF SPACECRAFT USING SLIDING MODE CONTROL AND PRODUCTIVE NETWORKS, International Journal of Systems Science, 28(5), 1997, pp. 435-446
DIELECTRIC DEGRADATION OF CU SIO2/SI STRUCTURE DURING THERMAL ANNEALING/
Authors: CHIOU JC WANG HI CHEN MC
Citation: Jc. Chiou et al., DIELECTRIC DEGRADATION OF CU SIO2/SI STRUCTURE DURING THERMAL ANNEALING/, Journal of the Electrochemical Society, 143(3), 1996, pp. 990-994
TIW(N) AS DIFFUSION-BARRIERS BETWEEN CU AND SI
Authors: CHIOU JC JUANG KC CHEN MC
Citation: Jc. Chiou et al., TIW(N) AS DIFFUSION-BARRIERS BETWEEN CU AND SI, Journal of the Electrochemical Society, 142(7), 1995, pp. 2326-2331
THE PROCESSING WINDOWS FOR SELECTIVE COPPER CHEMICAL-VAPOR-DEPOSITIONFROM CU(HEXAFLUOROACETYLACETONATE)TRIMETHYLVINYLSILANE
Authors: CHIOU JC JUANG KC CHEN MC
Citation: Jc. Chiou et al., THE PROCESSING WINDOWS FOR SELECTIVE COPPER CHEMICAL-VAPOR-DEPOSITIONFROM CU(HEXAFLUOROACETYLACETONATE)TRIMETHYLVINYLSILANE, Journal of the Electrochemical Society, 142(1), 1995, pp. 177-182
COPPER CHEMICAL-VAPOR-DEPOSITION FROM CU(HEXAFLUOROACETYLACETONATE)TRIMETHYLVINYLSILANE
Authors: CHIOU JC CHEN YJ CHEN MC
Citation: Jc. Chiou et al., COPPER CHEMICAL-VAPOR-DEPOSITION FROM CU(HEXAFLUOROACETYLACETONATE)TRIMETHYLVINYLSILANE, Journal of electronic materials, 23(4), 1994, pp. 383-390
THERMAL-STABILITY OF CU COSI2 CONTACTED P+N SHALLOW JUNCTION WITH ANDWITHOUT TIW DIFFUSION BARRIER/
Authors: CHIOU JC CHEN MC
Citation: Jc. Chiou et Mc. Chen, THERMAL-STABILITY OF CU COSI2 CONTACTED P+N SHALLOW JUNCTION WITH ANDWITHOUT TIW DIFFUSION BARRIER/, Journal of the Electrochemical Society, 141(10), 1994, pp. 2804-2810
Risultati: 1-9 |