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Authors: CAHILL C COMPAGNO A ODONOVAN J SLATTERY O OMATHUNA SC BARRETT J SERTHELON I VAL C TIGNERES JP STERN J IVEY P MASGRANGEAS M COELLOVERA A
Citation: C. Cahill et al., THERMAL CHARACTERIZATION OF VERTICAL MULTICHIP MODULES MCM-V, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(4), 1995, pp. 765-772

Authors: COELLOVERA A
Citation: A. Coellovera, PACKAGING TECHNOLOGIES FOR SATELLITE EQUIPMENT, Electrical communication, (4), 1994, pp. 377-383
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