THERMAL CHARACTERIZATION OF VERTICAL MULTICHIP MODULES MCM-V

This paper describes the thermal characterization of a vertical multic hip module (MCM-V) technology. The MCMV technology encloses a stack of IC's in a three dimensional cube of plastic molding compound, with th e inter-chip electrical connections made on the outside faces of the c ube, Thermal measurements were carried out on two different sized modu les containing eight specially designed package evaluation test chips. Steady state and transient thermal results are presented. Simulation results are shown for two applications manufactured using the MCM-V te chnology; a 2 W, 16 chip 256 MBit DRAM module and a 3 W, 9 chip image processing system.