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Results:
1-4
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Results: 4
Fundamental issues in wafer bonding
Authors:
Gosele, U Bluhm, Y Kastner, G Kopperschmidt, P Krauter, G Scholz, R Schumacher, A Senz, S Tong, QY Huang, LJ Chao, YL Lee, TH
Citation:
U. Gosele et al., Fundamental issues in wafer bonding, J VAC SCI A, 17(4), 1999, pp. 1145-1152
Coherent frequency/phase modulation scheme
Authors:
Chung, CD Hung, FC Chao, YL
Citation:
Cd. Chung et al., Coherent frequency/phase modulation scheme, ELECTR LETT, 35(6), 1999, pp. 444-445
Low temperature InP layer transfer
Authors:
Tong, QY Chao, YL Huang, LJ Gosele, U
Citation:
Qy. Tong et al., Low temperature InP layer transfer, ELECTR LETT, 35(4), 1999, pp. 341-342
Onset of blistering in hydrogen-implanted silicon
Authors:
Huang, LJ Tong, QY Chao, YL Lee, TH Martini, T Gosele, U
Citation:
Lj. Huang et al., Onset of blistering in hydrogen-implanted silicon, APPL PHYS L, 74(7), 1999, pp. 982-984
Risultati:
1-4
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