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Citation: V. Gupta et al., Effect of humidity and temperature on the tensile strength of polyimide/silicon nitride interface and its implications for electronic device reliability, MAT SCI E A, 317(1-2), 2001, pp. 249-256

Authors: Gupta, V Hernandez, R Wu, JX Charconnet, P

Citation: V. Gupta et al., Interfacial adhesion and its degradation in selected metal/oxide and dielectric/oxide interfaces in multi-layer devices, VACUUM, 59(1), 2000, pp. 292-300