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Results:
1-10
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Results: 10
Authors:
Charles, HK
Beck, TJ
Feldmesser, HS
Magee, TC
Spisz, TS
Pisacane, VL
Citation: Hk. Charles et al., Precision bone and muscle loss measurements by advanced, multiple projection DEXA (AMPDXA) techniques for spaceflight applications, ACT ASTRONA, 49(3-10), 2001, pp. 447-450
Authors:
Charles, HK
Citation: Hk. Charles, Tradeoffs in multichip module yield and cost with known good die probability and repair, MICROEL REL, 41(5), 2001, pp. 715-733
Authors:
Mechtel, DM
Charles, HK
Francomacaro, AS
Citation: Dm. Mechtel et al., The development of poled polyimide dielectric layers for simultaneous testing and light guiding applications in MCM-Ds, MICROEL REL, 41(11), 2001, pp. 1847-1855
Authors:
Charles, HK
Citation: Hk. Charles, Technical services at APL - Introduction, J H APL TEC, 21(4), 2000, pp. 465-467
Authors:
Charles, HK
Weiner, JA
Citation: Hk. Charles et Ja. Weiner, The engineering, design, and fabrication facility: A unique APL resource, J H APL TEC, 21(4), 2000, pp. 478-493
Authors:
Charles, HK
Citation: Hk. Charles, The impact of electronic packaging at APL: Guest editor's introduction, J H APL TEC, 20(1), 1999, pp. 5-6
Authors:
Clatterbaugh, GV
Vichot, P
Charles, HK
Citation: Gv. Clatterbaugh et al., Some key issues in microelectronic packaging, J H APL TEC, 20(1), 1999, pp. 34-49
Authors:
Blum, NA
Charles, HK
Francomacaro, AS
Citation: Na. Blum et al., Multichip module substrates, J H APL TEC, 20(1), 1999, pp. 62-69
Authors:
Charles, HK
Citation: Hk. Charles, APL's packaging future: The next few years, J H APL TEC, 20(1), 1999, pp. 101-110
Authors:
Mechtel, DM
Charles, HK
Francomacaro, AS
Citation: Dm. Mechtel et al., Laser-based electro-optic testing of multichip module structures, MICROEL REL, 38(12), 1998, pp. 1847-1853
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