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Results: 1-7 |
Results: 7
Chemical and morphological studies of plasma-treated integrated circuit bond pads
Authors: Chong, YF Gopalakrishnan, R Tsang, CF Sarkar, G Lim, S Tatti, S
Citation: Yf. Chong et al., Chemical and morphological studies of plasma-treated integrated circuit bond pads, J ELEC MAT, 30(3), 2001, pp. 275-282
Study of the morphological modifications induced by laser annealing of preamorphized silicon
Authors: Chong, YF Pey, KL Lu, YF Wee, ATS See, A
Citation: Yf. Chong et al., Study of the morphological modifications induced by laser annealing of preamorphized silicon, SURF REV L, 8(5), 2001, pp. 441-445
An investigation on the plasma treatment of integrated circuit bond pads
Authors: Chong, YF Gopalakrishnan, R Tsang, CF Sarkar, G Lim, S Tatti, S
Citation: Yf. Chong et al., An investigation on the plasma treatment of integrated circuit bond pads, MICROEL REL, 40(7), 2000, pp. 1199-1206
Liquid-phase epitaxial growth of amorphous silicon during laser annealing of ultrashallow p(+)/n junctions
Authors: Chong, YF Pey, KL Lu, YF Wee, ATS Osipowicz, T Seng, HL See, A Dai, JY
Citation: Yf. Chong et al., Liquid-phase epitaxial growth of amorphous silicon during laser annealing of ultrashallow p(+)/n junctions, APPL PHYS L, 77(19), 2000, pp. 2994-2996
Annealing of ultrashallow p(+)/n junction by 248 nm excimer laser and rapid thermal processing with different preamorphization depths
Authors: Chong, YF Pey, KL Wee, ATS See, A Chan, L Lu, YF Song, WD Chua, LH
Citation: Yf. Chong et al., Annealing of ultrashallow p(+)/n junction by 248 nm excimer laser and rapid thermal processing with different preamorphization depths, APPL PHYS L, 76(22), 2000, pp. 3197-3199
A cleaning process for flip chip assemblies before encapsulation
Authors: Sarkar, G Chong, YF Collier, PA
Citation: G. Sarkar et al., A cleaning process for flip chip assemblies before encapsulation, J MAT SCI L, 18(1), 1999, pp. 63-65
A study of the factors affecting surface insulation resistance measurements
Authors: Sarkar, G Chong, YF Collier, PA
Citation: G. Sarkar et al., A study of the factors affecting surface insulation resistance measurements, J MAT SCI L, 17(23), 1998, pp. 1963-1965
Risultati: 1-7 |