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Results: 3

Authors: McNally, PJ Rantamaki, R Tuomi, T Danilewsky, AN Lowney, D Curley, JW Herbert, PAF
Citation: Pj. Mcnally et al., Mapping of mechanical, thermomechanical and wire-bond strain fields in packaged Si integrated circuits using synchrotron white beam x-ray topography, IEEE T COMP, 24(1), 2001, pp. 76-83

Authors: Mcnally, PJ Curley, JW Bolt, M Reader, A Tuomi, T Rantamaki, R Danilewsky, AN DeWolf, I
Citation: Pj. Mcnally et al., Monitoring of stress reduction in shallow trench isolation CMOS structuresvia synchrotron X-ray topography, electrical data and raman spectroscopy, J MAT S-M E, 10(5-6), 1999, pp. 351-358

Authors: McNally, PJ Danilewsky, AN Curley, JW Reader, A Rantamaki, R Tuomi, T Bolt, M Taskinen, M
Citation: Pj. Mcnally et al., The quality of 200 mm diameter epitaxial Si wafers for advanced CMOS technology monitored using synchrotron X-ray topography, MICROEL ENG, 45(1), 1999, pp. 47-56
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