Authors:
McNally, PJ
Rantamaki, R
Tuomi, T
Danilewsky, AN
Lowney, D
Curley, JW
Herbert, PAF
Citation: Pj. Mcnally et al., Mapping of mechanical, thermomechanical and wire-bond strain fields in packaged Si integrated circuits using synchrotron white beam x-ray topography, IEEE T COMP, 24(1), 2001, pp. 76-83
Authors:
Mcnally, PJ
Curley, JW
Bolt, M
Reader, A
Tuomi, T
Rantamaki, R
Danilewsky, AN
DeWolf, I
Citation: Pj. Mcnally et al., Monitoring of stress reduction in shallow trench isolation CMOS structuresvia synchrotron X-ray topography, electrical data and raman spectroscopy, J MAT S-M E, 10(5-6), 1999, pp. 351-358
Authors:
McNally, PJ
Danilewsky, AN
Curley, JW
Reader, A
Rantamaki, R
Tuomi, T
Bolt, M
Taskinen, M
Citation: Pj. Mcnally et al., The quality of 200 mm diameter epitaxial Si wafers for advanced CMOS technology monitored using synchrotron X-ray topography, MICROEL ENG, 45(1), 1999, pp. 47-56