Authors: MATTHYS L DEBAETSELIER E DOBBELAERE W GOEDERTIER W DEMEY G

Citation: L. Matthys et al., CALCULATION OF THERMOELASTIC STRESSES IN MICROELECTRONICS, Microelectronics and reliability, 38(3), 1998, pp. 443-448

Authors: WIECEK B DEBAETSELIER E DEMEY G

Citation: B. Wiecek et al., ACTIVE THERMOGRAPHY APPLICATION FOR SOLDER THICKNESS MEASUREMENT IN SURFACE MOUNTED DEVICE TECHNOLOGY, Microelectronics, 29(4-5), 1998, pp. 223-228

Authors: DEBAETSELIER E GOEDERTIER W DEMEY G

Citation: E. Debaetselier et al., A SURVEY OF THE THERMAL-STABILITY OF AN ACTIVE HEAT SINK, Microelectronics and reliability, 37(12), 1997, pp. 1805-1812