Authors: LIU YK COX CL DIEFENDORF RJ

Citation: Yk. Liu et al., FINITE-ELEMENT ANALYSIS OF THE EFFECTS OF GEOMETRY AND MICROSTRUCTUREON ELECTROMIGRATION IN CONFINED METAL LINES, Journal of applied physics, 83(7), 1998, pp. 3600-3608

Authors: LIU Y SINGH R POOLE K DIEFENDORF RJ HARRISS J CANNON K

Citation: Y. Liu et al., CHARACTERIZATION OF AL-Y ALLOY THIN-FILMS DEPOSITED BY DIRECT-CURRENTMAGNETRON SPUTTERING, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 15(6), 1997, pp. 1990-1994

Authors: LIU Y POOLE KF SINGH R HARRISS J DIEFENDORF RJ

Citation: Y. Liu et al., CHARACTERIZATION OF AL-1 WT-PERCENT Y THIN-FILMS FOR VLSI INTERCONNECTS, Thin solid films, 308, 1997, pp. 460-464

Authors: LIU YK DIEFENDORF RJ

Citation: Yk. Liu et Rj. Diefendorf, ON STRESS EVOLUTION AND INTERACTION DURING ELECTROMIGRATION IN NEAR BAMBOO STRUCTURE LINES, Applied physics letters, 71(21), 1997, pp. 3171-3173

Authors: DIEFENDORF RJ MAZLOUT L

Citation: Rj. Diefendorf et L. Mazlout, DYNAMIC-MODEL FOR THE CVD PROCESSING OF TIB2 FIBERS, Composites science and technology, 51(2), 1994, pp. 181-191