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Authors: SCHIMMEL DE DISLIS C
Citation: De. Schimmel et C. Dislis, EARLY MODELING AND ANALYSIS OF PACKAGED SYSTEMS - GUEST EDITORS INTRODUCTION, IEEE design & test of computers, 15(3), 1998, pp. 8-9

Authors: HARWIN WS LEIBER LO AUSTWICK GPG DISLIS C
Citation: Ws. Harwin et al., CLINICAL POTENTIAL AND DESIGN OF PROGRAMMABLE MECHANICAL IMPEDANCES FOR ORTHOTIC APPLICATIONS, Robotica, 16, 1998, pp. 523-530

Authors: GARG V STOGNER DJ ULMER C SCHIMMEL DE DISLIS C YALAMANCHILI S WILLS DS
Citation: V. Garg et al., EARLY ANALYSIS OF COST PERFORMANCE TRADE-OFFS IN MCM SYSTEMS/, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(3), 1997, pp. 308-319

Authors: ALANI A DISLIS C JALOWIECKI I
Citation: A. Alani et al., BURN-IN ECONOMICS MODEL FOR MULTICHIP MODULES, Electronics Letters, 32(25), 1996, pp. 2349-2351
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