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Results: 2
Plasma process technology for micromechanic measuring structures
Authors:
Dehoff, A Reetz, M Wandel, K Wolf, R
Citation:
A. Dehoff et al., Plasma process technology for micromechanic measuring structures, TEC MES, 68(2), 2001, pp. 57-60
Process and equipment simulation of dry silicon etching in the absence of ion bombardment
Authors:
Otto, T Wolf, H Streiter, R Dehoff, A Wandel, K Gessner, T
Citation:
T. Otto et al., Process and equipment simulation of dry silicon etching in the absence of ion bombardment, MICROEL ENG, 45(4), 1999, pp. 377-391
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