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Citation: L. Haslehurst et Nn. Ekere, PARAMETER INTERACTIONS IN STENCIL PRINTING OF SOLDER PASTE, JOURNAL OF ELECTRONICS MANUFACTURING, 6(4), 1996, pp. 307-316

Authors: MANNAN SH EKERE NN ISMAIL I CURRIE MA

Citation: Sh. Mannan et al., FLOW PROCESSES IN SOLDER PASTE DURING STENCIL PRINTING FOR SMT ASSEMBLY, Journal of materials science. Materials in electronics, 6(1), 1995, pp. 34-42

Authors: MANNAN SH EKERE NN ISMAIL I LO EK

Citation: Sh. Mannan et al., SQUEEGEE DEFORMATION STUDY IN THE STENCIL PRINTING OF SOLDER PASTES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 17(3), 1994, pp. 470-476